Adhesives & Sealants > NACURE, K-FLEX, K-KAT

Specialty chemicals for electronic applications

Amino Resin Catalyst   Resin Modifiers   2K PU Non-Tin Catalysts

Acid Catalysts

Product	System Type	Use Level	Attributes	TDS	Sample
Amino Resin Systems
NACURE 155	Low pressure Laminating Adhesives	0.2-0.5%	Best water resistance properties, preneutralize with amine for waterborne
NACURE 3525	Low pressure Laminating Adhesives	0.5-2.0%	Best stability, direct addition, good water resistance
K-CURE 1040	Low pressure Laminating Adhesives	0.1-0.8%	Fastest cure, preneutralize with amine for waterborne
NACURE 4000	Low pressure Laminating Adhesives	0.5-1.0%	For high imino and polymeric melamines

Resin Modifiers

Product	Composition	Application	Use Level	Attributes	TDS	Sample
K-FLEX 188	Polyester Polyol	2KPU Structural	5-20	Best resistance properties, highest toughness
K-FLEX A308	Polyester Polyol	2KPU Structural	5-20	Lowest viscosity and VOC, solventless and ultra high solids
K-FLEX UD-350W	Urethane Diol	Low Pressure Laminating Adhesive	2-10	Water soluble, without amine, co-solvent or surfactant
K-FLEX XM-B301	Modifier	2K Epoxy Structural	2-6	Faster low temperature cure with amine hardeners

Non-Tin Catalysts

Product	System Type	Attributes	TDS	Sample
2K PU Systems
K-KAT 348	2K Polyurethane Structural	Aliphatic isocyanates, similar cure to tin catalysts
K-KAT XK-604	2K Polyurethane Structural	Aromatic isocyanates (induction period with MDI), mercury replacement
K-KAT XK-614	2K Polyurethane Structural	Waterborne, solvent based and solvent-free, thermal bump, selective