Adhesives & Sealants > K-PURE, K-FLEX, K-KAT

Specialty chemicals for adhesives and sealants

Polyamide Thixotropes Polyester Diols Catalysts Adhesion Promoters

Polyamide Thixotropes

Addition of DISPARLON® provides thixotropy with good shear thinning for ease of application and excellent film build/bead formation. In liquid systems, suspension of fillers can be achieved with minimal effect on application viscosity.

Product	Form	Attributes	TDS	Sample
DISPARLON 6100	Powder	Lowest activation temperature
DISPARLON 6250	Powder	Reduced activation temperature
DISPARLON 6500	Powder	General use
DISPARLON AQH-800	Rheology modifier	Anti-settle/ anti-sag

Polyester Diols

Unique diols that can enhance mechanical properties and improve bond strength. K-FLEX® diols are solventless liquid polyester diols that range in viscosity from 400-12,000 cPs and can add a balance of flexibility, while retaining hardness. They are especially suited for adhesives that require good clarity and low color development.

Product	Form	Attributes	TDS	Sample
K-FLEX 188	Liquid	Best resistance properties, highest toughness
K-FLEX XM-366	Liquid	Lower viscosity, more flexibility
K-FLEX XM-332	Liquid	Lower viscosity, softest

Catalysts

K-KAT® catalysts are alternatives to tin and mercury catalysts for isocyanate, blocked isocyanate and moisture cure silane systems.

K-PURE® catalysts are 100% solids, latent thermal initiators for epoxy systems. These catalysts initiate reactions for epoxy/epoxy, epoxy/acid anhydride, epoxy/polyol and epoxy/benzoxazine systems. Applications include semiconductor manufacturing, electronic packaging, laminating and industrial/automotive adhesives.

Product	Form	Attributes	TDS	Sample
K-KAT 670	Liquid	Zinc complex
K-KAT XK-678	Liquid	Acid phosphate
K-KAT XK-661	Liquid	Zinc complex
K-KAT XK-604	Liquid	Hg alternative
K-PURE CXC-1612	Solid	80°C cure
K-PURE CXC-1614	Solid	100°C cure
K-PURE CXC-1615	Solution	120°C cure
K-PURE CXC-1765	Liquid	Epoxy and acid anhydride

Adhesion Promoters

K-FLEX® acetoacetates react to contribute polar groups in the polymer morphology and provide better adhesion to various substrates.Primary applications are 2K systems where one component is an amine, or where an amine is generated in the reaction.

NACURE® XC-293 is a solventborne adhesion promoter additive for aluminum substrates.

Product	Form	Substrate	TDS	Sample
K-FLEX XM-B301	Liquid	Metal or plastic
NACURE XC-293	Solution	Metal or plastic